TJA1029TK,118
vs
MCP2022AT-500E/ST
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SON
|
|
Package Description |
3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, SOT782-1, MO-229, HVSON-8
|
TSSOP,
|
Pin Count |
8
|
|
Manufacturer Package Code |
SOT782-1
|
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
10 Weeks
|
6 Weeks
|
Samacsys Manufacturer |
NXP
|
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G14
|
Length |
3 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
14
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
AEC-Q100
|
TS 16949
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Supply Voltage-Nom |
5 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
CAN TRANSCEIVER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e3
|
Number of Transceivers |
|
1
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
TSSOP14,.25
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare TJA1029TK,118 with alternatives
-
TJA1029TK,118 vs IFX1040SJXUMA1
-
TJA1029TK,118 vs TJA1042T/3/1J
-
TJA1029TK,118 vs TJA1059TKJ
-
TJA1029TK,118 vs TJA1042TK/3,118
-
TJA1029TK,118 vs TLE62543GXUMA1
-
TJA1029TK,118 vs TJA1052IT/5Y
-
TJA1029TK,118 vs TJA1042T/1J
-
TJA1029TK,118 vs TJA1043T/1J
-
TJA1029TK,118 vs TLE9255WSKXUMA1
Compare MCP2022AT-500E/ST with alternatives