TJA1027T/20/1J
vs
935290083027
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
|
Package Description |
3.90 MM, GREEN, PLASTIC, MS-012, SOT96-1, SOP-8
|
DIE,
|
Pin Count |
8
|
|
Manufacturer Package Code |
SOT96-1
|
|
Reach Compliance Code |
compliant
|
unknown
|
Factory Lead Time |
10 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
JESD-30 Code |
R-PDSO-G8
|
R-XUUC-N13
|
JESD-609 Code |
e4
|
|
Length |
4.9 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
13
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DIE
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.39.00.01
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare TJA1027T/20/1J with alternatives
Compare 935290083027 with alternatives