TJA1022TK
vs
MCP2022-330E/P
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVSON,
|
DIP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
R-PDSO-N14
|
R-PDIP-T14
|
| Length |
4.5 mm
|
19.05 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
AEC-Q100
|
TS 16949
|
| Seated Height-Max |
1 mm
|
5.334 mm
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
NO
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
LIN TRANSCEIVER
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e3
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
DIP14,.3
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare TJA1022TK with alternatives
Compare MCP2022-330E/P with alternatives