TJA1022TK
vs
935290083029
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
HVSON,
|
DIE,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
R-PDSO-N14
|
R-XUUC-N13
|
| Length |
4.5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
13
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVSON
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TJA1022TK with alternatives
Compare 935290083029 with alternatives