TIC226M vs BT137-600 feature comparison

TIC226M JW Miller

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BT137-600 Comset Semiconductor

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Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer POWER INNOVATIONS LTD COMSET SEMICONDUCTORS
Part Package Code SFM
Package Description FLANGE MOUNT, R-PSFM-T3 ,
Pin Count 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.30.00.80
Case Connection MAIN TERMINAL 2
Configuration SINGLE
Critical Rate of Rise of Commutation Voltage-Min 5 V/us
DC Gate Trigger Current-Max 50 mA
DC Gate Trigger Voltage-Max 2 V
Holding Current-Max 30 mA
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
Number of Elements 1
Number of Terminals 3
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Qualification Status Not Qualified
RMS On-state Current-Max 8 A
Repetitive Peak Off-state Leakage Current-Max 2000 µA
Repetitive Peak Off-state Voltage 600 V
Surface Mount NO
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Trigger Device Type 4 QUADRANT LOGIC LEVEL TRIAC
Base Number Matches 7 6

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