TIC225M vs 933389620127 feature comparison

TIC225M JW Miller

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933389620127 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer POWER INNOVATIONS LTD NXP SEMICONDUCTORS
Part Package Code SFM TO-220AB
Package Description FLANGE MOUNT, R-PSFM-T3 PLASTIC, SC-46, 3 PIN
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.30.00.80 8541.30.00.80
Additional Feature SENSITIVE GATE
Case Connection MAIN TERMINAL 2 MAIN TERMINAL 2
Configuration SINGLE SINGLE
DC Gate Trigger Current-Max 5 mA
DC Gate Trigger Voltage-Max 2 V
Holding Current-Max 20 mA
JEDEC-95 Code TO-220AB TO-220AB
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Qualification Status Not Qualified Not Qualified
RMS On-state Current-Max 8 A 12 A
Repetitive Peak Off-state Leakage Current-Max 2000 µA
Repetitive Peak Off-state Voltage 600 V 800 V
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Trigger Device Type 4 QUADRANT LOGIC LEVEL TRIAC 4 QUADRANT LOGIC LEVEL TRIAC
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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