TIBPAL16R8-20MFK vs AMPAL20L8ADC feature comparison

TIBPAL16R8-20MFK Texas Instruments

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AMPAL20L8ADC AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC ADVANCED MICRO DEVICES INC
Part Package Code QFN DIP
Package Description QCCN, LCC20,.35SQ DIP, DIP24,.3
Pin Count 20 24
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature POWER-UP RESET
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 41.6 MHz
JESD-30 Code S-CQCC-N20 R-GDIP-T24
Length 8.89 mm
Number of Dedicated Inputs 8 14
Number of I/O Lines 6
Number of Inputs 8 20
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 24
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 8 DEDICATED INPUTS, 0 I/O 14 DEDICATED INPUTS, 6 I/O
Output Function REGISTERED COMBINATORIAL
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DIP
Package Equivalence Code LCC20,.35SQ DIP24,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type OT PLD OT PLD
Propagation Delay 15 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.03 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8.89 mm
Base Number Matches 1 2
JESD-609 Code e0
Terminal Finish TIN LEAD

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