THS7327PHPR
vs
THS7347IPHPR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
GREEN, PLASTIC, HTQFP-48
|
GREEN, PLASTIC, HTQFP-48
|
Pin Count |
48
|
48
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Amplifier Type |
BUFFER
|
BUFFER
|
Average Bias Current-Max (IIB) |
3.5 µA
|
3.5 µA
|
Bandwidth (3dB)-Nom |
500 MHz
|
550 MHz
|
JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
JESD-609 Code |
e4
|
e4
|
Length |
7 mm
|
7 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
3
|
3
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Min |
0.045 A
|
0.045 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
HTFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Slew Rate-Nom |
1050 V/us
|
1050 V/us
|
Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
7 mm
|
7 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare THS7327PHPR with alternatives
Compare THS7347IPHPR with alternatives