THMY7232G1EG-75 vs HYS72V64601GR-7.5-C2 feature comparison

THMY7232G1EG-75 Toshiba America Electronic Components

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HYS72V64601GR-7.5-C2 Infineon Technologies AG

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP INFINEON TECHNOLOGIES AG
Part Package Code DIMM DIMM
Package Description DIMM, DIMM168 ,
Pin Count 168 168
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode DUAL BANK PAGE BURST SINGLE BANK PAGE BURST
Access Time-Max 5.4 ns 5.4 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
I/O Type COMMON
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Length 133.35 mm
Memory Density 4831838208 bit 4831838208 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64MX72 64MX72
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM168
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096
Seated Height-Max 34.85 mm
Self Refresh YES YES
Standby Current-Max 0.018 A
Supply Current-Max 3.42 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 4 mm
Base Number Matches 1 1

Compare THMY7232G1EG-75 with alternatives

Compare HYS72V64601GR-7.5-C2 with alternatives