THMY648071BEG-80
vs
MB8508S064CG-100DG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
FUJITSU LTD
|
| Part Package Code |
DIMM
|
DIMM
|
| Package Description |
DIMM, DIMM168
|
,
|
| Pin Count |
168
|
168
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.28
|
8542.32.00.28
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
6 ns
|
8.5 ns
|
| Clock Frequency-Max (fCLK) |
125 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-XDMA-N168
|
R-XDMA-N168
|
| Memory Density |
536870912 bit
|
536870912 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM MODULE
|
SYNCHRONOUS DRAM MODULE
|
| Memory Width |
64
|
64
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
168
|
168
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8MX64
|
8MX64
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIMM
|
|
| Package Equivalence Code |
DIMM168
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
4096
|
|
| Seated Height-Max |
30.48 mm
|
|
| Standby Current-Max |
0.008 A
|
|
| Supply Current-Max |
1.12 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare THMY648071BEG-80 with alternatives
Compare MB8508S064CG-100DG with alternatives