THM321000ASG-70
vs
MC-421000A32F-10
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
SIMM
|
|
| Package Description |
SIMM-72
|
SIMM-72
|
| Pin Count |
72
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Mode |
FAST PAGE
|
FAST PAGE
|
| Access Time-Max |
70 ns
|
100 ns
|
| Additional Feature |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
|
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
| Alternate Memory Width |
16
|
16
|
| JESD-30 Code |
R-XSMA-N72
|
R-XSMA-N72
|
| Memory Density |
33554432 bit
|
33554432 bit
|
| Memory IC Type |
FAST PAGE DRAM MODULE
|
FAST PAGE DRAM MODULE
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
72
|
72
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1MX32
|
1MX32
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
1024
|
1024
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
1
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.02
|
| Output Characteristics |
|
3-STATE
|
|
|
|
Compare THM321000ASG-70 with alternatives