TG2401F vs UPC8125GR-E1 feature comparison

TG2401F Toshiba America Electronic Components

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UPC8125GR-E1 NEC Electronics Group

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NEC ELECTRONICS CORP
Part Package Code SOIC SSOP
Package Description HTSSOP, SSOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Length 5 mm
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.04 mm 1.8 mm
Supply Current-Max 170 mA 48 mA
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology GAAS BIPOLAR
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 1

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