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TG2401F vs SA58641DK,112 feature comparison

TG2401F Toshiba America Electronic Components

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SA58641DK,112 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP2
Package Description HTSSOP, LSSOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e4
Length 5 mm 6.5 mm
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.04 mm 1.5 mm
Supply Current-Max 170 mA 8.5 mA
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology GAAS
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 1
Manufacturer Package Code SOT266-1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Telecommunication Circuits » Cordless Telephone ICs
Telecommunication Circuits » Cordless Telephone ICs

Compare TG2401F with alternatives

Compare SA58641DK,112 with alternatives