TFA1206R1273F-T5
vs
RC3216F1273FS
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
THIN FILM TECHNOLOGY CORP
SAMSUNG ELECTRO-MECHANICS
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Rectangular
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
3.05 mm
3.2 mm
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, Paper, 7 Inch
TR, 13 INCH
Rated Power Dissipation (P)
0.25 W
0.25 W
Rated Temperature
70 °C
70 °C
Reference Standard
AEC-Q200
Resistance
127000 Ω
127000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Pbfree Code
Yes
Additional Feature
PRECISION
Package Shape
RECTANGULAR PACKAGE
Compare TFA1206R1273F-T5 with alternatives
Compare RC3216F1273FS with alternatives