TEPSLD0G477M(15)12R
vs
T520D477M4AHE040
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
KEMET ELECTRONICS CORP
|
KEMET ELECTRONICS CORP
|
| Package Description |
CHIP, ROHS COMPLIANT
|
, 2917
|
| Reach Compliance Code |
unknown
|
compliant
|
| Capacitance |
470 µF
|
470 µF
|
| Capacitor Type |
TANTALUM CAPACITOR
|
TANTALUM CAPACITOR
|
| Dielectric Material |
TANTALUM (SOLID POLYMER)
|
TANTALUM (SOLID POLYMER)
|
| JESD-609 Code |
e3
|
e0
|
| Leakage Current |
0.188 mA
|
0.188 mA
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Packing Method |
TR, 7 INCH
|
TR, EMBOSSED PLASTIC, 7/13 INCH
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
4 V
|
4 V
|
| Ripple Current |
3162 mA
|
600 mA
|
| Size Code |
2917
|
2917
|
| Surface Mount |
YES
|
YES
|
| Tan Delta |
0.1
|
0.1
|
| Terminal Finish |
Matte Tin (Sn) - reflowed over Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb)
|
| Terminal Shape |
J BEND
|
J BEND
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8532.21.00.50
|
|
|
|
Compare TEPSLD0G477M(15)12R with alternatives
Compare T520D477M4AHE040 with alternatives