TEA5500TD
vs
SL486NADP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
GEC PLESSEY SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SOP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.33.00.01
Consumer IC Type
SUPPORT CIRCUIT
PREAMPLIFIER
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
Length
10.3 mm
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
80 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
Supply Voltage-Max (Vsup)
6.5 V
7 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Surface Mount
YES
NO
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Transmission Media
INFRARED
Width
7.5 mm
Base Number Matches
1
3
Rohs Code
ECCN Code
EAR99
JESD-609 Code
e0
Package Equivalence Code
DIP16(UNSPEC)
Supply Current-Max
10 mA
Terminal Finish
TIN LEAD
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