TEA5500TD vs SL486NADP feature comparison

TEA5500TD NXP Semiconductors

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SL486NADP Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ZARLINK SEMICONDUCTOR INC
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SUPPORT CIRCUIT SUPPORT CIRCUIT
JESD-30 Code R-PDSO-G16 R-PDIP-T16
Length 10.3 mm 20.32 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 80 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 5.08 mm
Supply Voltage-Max (Vsup) 6.5 V 7 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Surface Mount YES NO
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Transmission Media INFRARED INFRARED
Width 7.5 mm 7.62 mm
Base Number Matches 1 3
JESD-609 Code e0
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 260
Supply Current-Max 10 mA
Terminal Finish TIN LEAD

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