TEA1118AT-T
vs
TEA1118AT
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
SOP, SOP14,.25
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
e0
|
| Length |
8.65 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Current-Max |
1.4 mA
|
1.4 mA
|
| Supply Voltage-Nom |
2.9 V
|
2.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Telecom IC Type |
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Package Equivalence Code |
|
SOP14,.25
|
|
|
|
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