TE28F008SC-170
vs
LH28F008SCHT-L12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
SHARP CORP
Part Package Code
TSOP
Package Description
10 X 20 MM, TSOP-40
10 X 20 MM, PLASTIC, TSOP1-40
Pin Count
40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
170 ns
170 ns
JESD-30 Code
R-PDSO-G40
R-PDSO-G40
Length
18.4 mm
18.4 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
1MX8
1MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
10 mm
10 mm
Base Number Matches
1
1
Additional Feature
ACCESS TIME 150 NS AT VCC 3.3+/-0.3V
JESD-609 Code
e6
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage-Nom (Vsup)
3 V
Terminal Finish
TIN BISMUTH
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare TE28F008SC-170 with alternatives
Compare LH28F008SCHT-L12 with alternatives