TE05E2611AT vs MCWF08W2611BTL feature comparison

TE05E2611AT Fenghua (HK) Electronics Ltd

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MCWF08W2611BTL SPC Multicomp

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY MULTICOMP PRO
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Rectangular RECTANGULAR PACKAGE
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.5 mm 0.5 mm
Package Length 2 mm 2 mm
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C 70 °C
Resistance 2610 Ω 2610 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 10 ppm/°C 10 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.05% 0.1%
Working Voltage 100 V 100 V
Base Number Matches 1 1
Additional Feature HIGH PRECISION, LASER TRIMMABLE
Package Shape RECTANGULAR PACKAGE

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Compare MCWF08W2611BTL with alternatives