TDF8599ATH/N2CS
vs
TDF8599ATH/N2,518
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
PLASTIC, SO-851-2, HSOP-36
|
PLASTIC, SO-851-2, HSOP-36
|
Pin Count |
36
|
36
|
Manufacturer Package Code |
SOT851-2
|
SOT851-2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Factory Lead Time |
26 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
26 dB
|
26 dB
|
Harmonic Distortion |
10%
|
10%
|
JESD-30 Code |
R-PDSO-G36
|
R-PDSO-G36
|
Length |
15.9 mm
|
15.9 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
36
|
36
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
135 W
|
135 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSSOP
|
SSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max (Vsup) |
35 V
|
35 V
|
Supply Voltage-Min (Vsup) |
8 V
|
8 V
|
Surface Mount |
YES
|
YES
|
Technology |
BCDMOS
|
BCDMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
SSOP36,.56
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
120 mA
|
|
|
|
Compare TDF8599ATH/N2CS with alternatives
Compare TDF8599ATH/N2,518 with alternatives