TDA9109/S
vs
TDA4856
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
SHRINK, PLASTIC, DIP-32
SDIP, SDIP32,.4
Pin Count
32
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IT ALSO REQUIRES 10.8V TO 13.2V SUPPLY
Application
MONITOR
MONITOR
Blanking Output
NO
YES
Consumer IC Type
HORIZ/VERT DEFLECTION IC
HORIZ/VERT DEFLECTION IC
JESD-30 Code
R-PDIP-T32
R-PDIP-T32
JESD-609 Code
e0
Length
27.94 mm
28.95 mm
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SDIP
SDIP
Package Equivalence Code
SDIP32,.4
SDIP32,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, SHRINK PITCH
IN-LINE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.7 mm
Supply Voltage-Max (Vsup)
5.5 V
16 V
Supply Voltage-Min (Vsup)
4.5 V
9.2 V
Surface Mount
NO
NO
Technology
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.778 mm
1.778 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
2
1
Pbfree Code
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
40
Compare TDA9109/S with alternatives
Compare TDA4856 with alternatives