TDA8932TW vs TDA8932T feature comparison

TDA8932TW NXP Semiconductors

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TDA8932T NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP SOIC
Package Description TSSOP, SOP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Bandwidth-Nom 20 kHz 20 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
Gain 30 dB 30 dB
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e3
Length 11 mm 20.5 mm
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 25 W 25 W
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP32,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 2.65 mm
Supply Voltage-Max (Vsup) 36 V 36 V
Supply Voltage-Min (Vsup) 10 V 10 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 6.1 mm 7.5 mm
Base Number Matches 1 4

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Compare TDA8932T with alternatives