TDA8357J
vs
TDA3653CQ/N2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
ZIP, ZIP9,.2
ZIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
VERTICAL DEFLECTION IC
VERTICAL DEFLECTION IC
JESD-30 Code
R-PZIP-T9
R-PZIP-T9
JESD-609 Code
e3
Number of Terminals
9
9
Operating Temperature-Max
70 °C
Operating Temperature-Min
-25 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
ZIP
ZIP
Package Equivalence Code
ZIP9,.2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
BCDMOS
Temperature Grade
OTHER
Terminal Finish
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
ZIG-ZAG
ZIG-ZAG
Base Number Matches
2
1
Part Package Code
SOT
Pin Count
157
Blanking Output
NO
Number of Functions
1
Seated Height-Max
17 mm
Supply Voltage-Max (Vsup)
60 V
Supply Voltage-Min (Vsup)
10 V
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