TDA8351/N6,112
vs
TDA8357J
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SIP
|
|
| Package Description |
SIP,
|
ZIP, ZIP9,.2
|
| Pin Count |
9
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Blanking Output |
YES
|
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PSIP-T9
|
R-PZIP-T9
|
| JESD-609 Code |
e3
|
e3
|
| Length |
23.8 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SIP
|
ZIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
14.2 mm
|
|
| Supply Voltage-Max (Vsup) |
25 V
|
|
| Supply Voltage-Min (Vsup) |
9 V
|
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
TIN
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
SINGLE
|
ZIG-ZAG
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Package Equivalence Code |
|
ZIP9,.2
|
| Technology |
|
BCDMOS
|
|
|
|
Compare TDA8351/N6,112 with alternatives