TDA8143 vs TDA8351 feature comparison

TDA8143 STMicroelectronics

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TDA8351 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Part Package Code SFM SIP
Package Description SIP-9 POWER, PLASTIC, SOT-131-2, SIP-9
Pin Count 9 9
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Application TV
Blanking Output NO YES
Consumer IC Type HORIZONTAL DEFLECTION IC VERTICAL DEFLECTION IC
JESD-30 Code R-PSFM-T9 R-PSIP-T9
JESD-609 Code e0 e3
Number of Functions 1 1
Number of Terminals 9 9
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SFM SIP
Package Equivalence Code SIP9,.1TB SIP9,.1
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 25 V
Supply Voltage-Min (Vsup) 7 V 9 V
Surface Mount NO NO
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position SINGLE SINGLE
Base Number Matches 1 2
Length 23.8 mm
Seated Height-Max 14.2 mm
Technology BIPOLAR
Width 4.4 mm

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