TDA3653B/N2,112
vs
TDA8359J/N2,112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SFM
ZIP
Package Description
POWER, PLASTIC, SOT-110-1, SIP-9
ZIP,
Pin Count
9
9
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Blanking Output
NO
NO
Consumer IC Type
VERTICAL DEFLECTION IC
VERTICAL DEFLECTION IC
JESD-30 Code
R-PSFM-T9
R-PZIP-T9
JESD-609 Code
e3
e3
Number of Functions
1
1
Number of Terminals
9
9
Operating Temperature-Max
150 °C
85 °C
Operating Temperature-Min
-25 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SFM
ZIP
Package Equivalence Code
SIP9,.1TB
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
60 V
18 V
Supply Voltage-Min (Vsup)
10 V
7.5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BCDMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN
Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
SINGLE
ZIG-ZAG
Base Number Matches
1
1
Application
TV
Length
13 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
21.4 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
2.5 mm
Compare TDA3653B/N2,112 with alternatives
Compare TDA8359J/N2,112 with alternatives