TD83C51FB-2 vs TD83C51FB feature comparison

TD83C51FB-2 Intel Corporation

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TD83C51FB Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code DIP DIP
Package Description CERDIP-40 CERDIP-40
Pin Count 40 40
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
CPU Family 8051 8051
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-GDIP-T40 R-GDIP-T40
Length 52.325 mm 52.325 mm
Low Power Mode YES YES
Number of DMA Channels
Number of External Interrupts 2 2
Number of I/O Lines 32 32
Number of Serial I/Os 1 1
Number of Terminals 40 40
Number of Timers 3 3
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
RAM (words) 256 256
ROM (words) 16384 16384
ROM Programmability MROM MROM
Seated Height-Max 5.72 mm 5.72 mm
Speed 12 MHz 12 MHz
Supply Current-Max 30 mA 30 mA
Supply Voltage-Max 6 V 6 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1

Compare TD83C51FB-2 with alternatives

Compare TD83C51FB with alternatives