TD83C51FB-2 vs N83C51FB-2 feature comparison

TD83C51FB-2 Intel Corporation

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N83C51FB-2 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code DIP LCC
Package Description CERDIP-40 PLASTIC, LCC-44
Pin Count 40 44
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
CPU Family 8051 8051
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-GDIP-T40 S-PQCC-J44
Length 52.325 mm 16.5862 mm
Low Power Mode YES YES
Number of DMA Channels
Number of External Interrupts 2 2
Number of I/O Lines 32 32
Number of Serial I/Os 1 1
Number of Terminals 40 44
Number of Timers 3 3
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP40,.6 LDCC44,.7SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
RAM (words) 256 256
ROM (words) 16384 16384
ROM Programmability MROM MROM
Seated Height-Max 5.72 mm 4.57 mm
Speed 12 MHz 12 MHz
Supply Current-Max 30 mA 30 mA
Supply Voltage-Max 6 V 6 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 16.5862 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1

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