TD80C31BH vs 80C31BH/BQA feature comparison

TD80C31BH AMD

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80C31BH/BQA NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NXP SEMICONDUCTORS
Package Description DIP-40 CERAMIC, DIP-40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 8 8
CPU Family 8051 8051
JESD-30 Code R-XDIP-T40 R-GDIP-T40
JESD-609 Code e0
Number of Terminals 40 40
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 128 128
Speed 12 MHz 12 MHz
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 5
Part Package Code DIP
Pin Count 40
ECCN Code 3A001.A.2.C
Samacsys Manufacturer NXP
Has ADC NO
Address Bus Width 16
Boundary Scan NO
Clock Frequency-Max 12 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 8
Format FIXED POINT
Integrated Cache NO
Length 52.3875 mm
Low Power Mode YES
Number of I/O Lines 32
PWM Channels NO
ROM (words) 0
ROM Programmability ROM LESS
Seated Height-Max 5.588 mm
Supply Current-Max 20 mA
Supply Voltage-Max 6 V
Supply Voltage-Min 4 V
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

Compare TD80C31BH with alternatives

Compare 80C31BH/BQA with alternatives