TD2732A
vs
AM2732B-200DE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-24
WDIP, DIP24,.6
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
250 ns
200 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
32.004 mm
32.0675 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4KX8
4KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
21 V
12.5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.588 mm
Supply Current-Max
0.125 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
HMOS
NMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
6
1
Pbfree Code
Compare TD2732A with alternatives
Compare AM2732B-200DE with alternatives