TCMIE226CTLSR900
vs
B45198H5226M309
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CAL-CHIP ELECTRONICS INC
|
KEMET ELECTRONICS CORP
|
| Package Description |
CHIP
|
, 2312
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ
|
|
| Capacitance |
22 µF
|
22 µF
|
| Capacitor Type |
TANTALUM CAPACITOR
|
TANTALUM CAPACITOR
|
| Dielectric Material |
TANTALUM (DRY/SOLID)
|
TANTALUM (DRY/SOLID)
|
| ESR |
900 mΩ
|
|
| Height |
2.6 mm
|
2.5 mm
|
| JESD-609 Code |
e3
|
e4
|
| Leakage Current |
0.0055 mA
|
0.0055 mA
|
| Length |
6 mm
|
6 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
TR, EMBOSSED PLASTIC, 7 INCH
|
TR, 7 INCH
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
25 V
|
25 V
|
| Ripple Current |
140 mA
|
|
| Size Code |
2312
|
2312
|
| Surface Mount |
YES
|
YES
|
| Tan Delta |
0.06
|
0.06
|
| Terminal Finish |
Matte Tin (Sn)
|
Gold (Au)
|
| Terminal Shape |
J BEND
|
J BEND
|
| Width |
3.2 mm
|
3.2 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8532.21.00.50
|
| Manufacturer Series |
|
B45198H
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Series |
|
B45-HIGH CAPACITANCE
|
|
|
|
Compare TCMIE226CTLSR900 with alternatives
Compare B45198H5226M309 with alternatives