TCM829ECT713
vs
MAX1044MJA/883B
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOT-23
|
DIP
|
| Package Description |
LSSOP,
|
DIP, DIP8,.3
|
| Pin Count |
5
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog IC - Other Type |
SWITCHED CAPACITOR CONVERTER
|
SWITCHED CAPACITOR CONVERTER
|
| Input Voltage-Max |
5.5 V
|
10 V
|
| Input Voltage-Min |
1.5 V
|
1.5 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
R-PDSO-G5
|
R-GDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2.9 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
LSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.45 mm
|
5.08 mm
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
DOUBLER INVERTER
|
DOUBLER INVERTER
|
| Switching Frequency-Max |
45.5 kHz
|
10 kHz
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.95 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.55 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Package Equivalence Code |
|
DIP8,.3
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare TCM829ECT713 with alternatives
Compare MAX1044MJA/883B with alternatives