TCM828ECT713
vs
MAX860ESA+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOT-23
|
SOIC
|
| Package Description |
LSSOP,
|
SOP, SOP8,.25
|
| Pin Count |
5
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog IC - Other Type |
SWITCHED CAPACITOR CONVERTER
|
SWITCHED CAPACITOR CONVERTER
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
1.5 V
|
1.5 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.9 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.45 mm
|
1.75 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
DOUBLER INVERTER
|
DOUBLER INVERTER
|
| Switching Frequency-Max |
15.6 kHz
|
130 kHz
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.55 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Output Current-Max |
|
0.06 A
|
| Package Equivalence Code |
|
SOP8,.25
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TCM828ECT713 with alternatives
Compare MAX860ESA+T with alternatives