TCM810TELB713
vs
TCM809TENB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
SOT-23
Package Description
TSSOP, TSSOP6,.08
TSOP,
Pin Count
3
3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Adjustable Threshold
NO
NO
Analog IC - Other Type
VOLTAGE SUPERVISOR/RESET IC
VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Length
2.025 mm
2.86 mm
Moisture Sensitivity Level
1
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
3
3
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSOP
Package Equivalence Code
TSSOP6,.08
TO-236
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.12 mm
Supply Current-Max (Isup)
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.95 mm
Terminal Position
DUAL
DUAL
Threshold Voltage-Nom
+3.08V
Time@Peak Reflow Temperature-Max (s)
40
40
Width
1.25 mm
1.3 mm
Base Number Matches
1
2
Compare TCM810TELB713 with alternatives
Compare TCM809TENB with alternatives