TCM810SVLB713
vs
TCM810SVNB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TELCOM SEMICONDUCTOR INC
Part Package Code
SOIC
Package Description
TSSOP, TSSOP6,.08
SOT-23B, 3 PIN
Pin Count
3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Adjustable Threshold
NO
NO
Analog IC - Other Type
VOLTAGE SUPERVISOR/RESET IC
VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
Length
2.025 mm
2.86 mm
Moisture Sensitivity Level
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
3
3
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSOP
Package Equivalence Code
TSSOP3/6,.08
TO-236
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
1.1 mm
1.12 mm
Supply Current-Max (Isup)
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.95 mm
Terminal Position
DUAL
DUAL
Threshold Voltage-Nom
+2.93V
+2.93V
Time@Peak Reflow Temperature-Max (s)
40
Width
1.25 mm
1.3 mm
Base Number Matches
1
2
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