TCM809TENBG vs TCM810TENB713G feature comparison

TCM809TENBG Microchip Technology Inc

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TCM810TENB713G Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code SOT-23 SOT-23
Package Description TSOP, TSSOP,
Pin Count 3 3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Adjustable Threshold NO NO
Analog IC - Other Type VOLTAGE SUPERVISOR/RESET IC VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e3
Length 2.86 mm 2.92 mm
Moisture Sensitivity Level 1 1
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 3 3
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP TSSOP
Package Equivalence Code TO-236 TO-236
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.12 mm 1.12 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1 V 1 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.96 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 1.3 mm 1.3 mm
Base Number Matches 1 1

Compare TCM809TENBG with alternatives

Compare TCM810TENB713G with alternatives