TCM809TENB713G
vs
TCM810TENB723
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TELCOM SEMICONDUCTOR INC
Part Package Code
SOT-23
Package Description
TSSOP,
,
Pin Count
3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Adjustable Threshold
NO
NO
Analog IC - Other Type
VOLTAGE SUPERVISOR/RESET IC
POWER SUPPLY SUPPORT CIRCUIT
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
Length
2.92 mm
Moisture Sensitivity Level
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
3
3
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TO-236
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.12 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.96 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
1.3 mm
Base Number Matches
1
1
Supply Current-Max (Isup)
0.05 mA
Compare TCM809TENB713G with alternatives
Compare TCM810TENB723 with alternatives