TCM29C18N
vs
S5T8557B02-L0B0
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
DIP-16
|
DIP,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
FULL DUPLEX
|
|
| Companding Law |
MU-LAW
|
A-LAW
|
| Filter |
YES
|
YES
|
| Gain Tolerance-Max |
2.5 dB
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| Length |
19.305 mm
|
19.495 mm
|
| Linear Coding |
NOT AVAILABLE
|
|
| Neg Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Mode |
SYNCHRONOUS/ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
|
|
|
Compare TCM29C18N with alternatives
Compare S5T8557B02-L0B0 with alternatives