TCLLZ5224C
vs
MX1N5224C-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
MICROSEMI CORP
Part Package Code
MELF
DO-35
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, LL-34, MINIMELF-2
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
JESD-30 Code
O-LELF-R2
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
250
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Not Qualified
Reference Voltage-Nom
2.8 V
2.8 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Voltage Tol-Max
2%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
2
4
Additional Feature
METALLURGICALLY BONDED
JEDEC-95 Code
DO-204AH
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Compare TCLLZ5224C with alternatives
Compare MX1N5224C-1 with alternatives