TCBZX55B10TB
vs
BZX55B10-TP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
MICRO COMMERCIAL COMPONENTS CORP
Part Package Code
DO-35
DO-35
Package Description
O-LALF-W2
GLASS PACKAGE-2
Pin Count
2
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
10 V
10 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
2%
2%
Working Test Current
5 mA
5 mA
Base Number Matches
1
1
Moisture Sensitivity Level
1
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
10
Compare TCBZX55B10TB with alternatives
Compare BZX55B10-TP with alternatives