TCBZV55C56 vs BZV55C56T2 feature comparison

TCBZV55C56 Tak Cheong Electronics (Holdings) Co Ltd

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BZV55C56T2 Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TAK CHEONG ELECTRONICS HOLDINGS CO LTD MOTOROLA INC
Part Package Code DO-213AC DO-34
Package Description O-LELF-R2 O-LELF-N2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 135 Ω
JEDEC-95 Code DO-213AC
JESD-30 Code O-LELF-R2 O-LELF-N2
JESD-609 Code e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 56 V 56 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish Matte Tin (Sn)
Terminal Form WRAP AROUND NO LEAD
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 7.14% 7.14%
Working Test Current 2.5 mA 2 mA
Base Number Matches 2 1
Manufacturer Package Code CASE 362-03

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