TCA6416AZQSR
vs
MAX7311ATG+TGH7
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA-24
|
TQFN-24
|
Pin Count |
24
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Additional Feature |
IT ALSO OPERATES AT 2.5V, 3.3V AND 5V
|
|
Clock Frequency-Max |
0.4 MHz
|
0.4 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B24
|
S-PQCC-N24
|
JESD-609 Code |
e1
|
e3
|
Length |
3 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
16
|
|
Number of I/O Lines |
16
|
16
|
Number of Ports |
2
|
2
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVQCCN
|
Package Equivalence Code |
BGA24,5X5,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
0.8 mm
|
Supply Current-Max |
0.02 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
1.65 V
|
2 V
|
Supply Voltage-Nom |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
MATTE TIN
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TCA6416AZQSR with alternatives
Compare MAX7311ATG+TGH7 with alternatives