TC911BCPA vs TLC4501ID feature comparison

TC911BCPA Telcom Semiconductor Inc

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TLC4501ID Rochester Electronics LLC

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer TELCOM SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Package Description PLASTIC, DIP-8 GREEN, PLASTIC, SOIC-8
Reach Compliance Code unknown unknown
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture CHOPPER-STAB
Average Bias Current-Max (IIB) 0.004 µA 0.00006 µA
Bias Current-Max (IIB) @25C 0.00012 µA
Common-mode Reject Ratio-Nom 110 dB 100 dB
Frequency Compensation YES
Input Offset Voltage-Max 30 µV 80 µV
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e0 e4
Low-Bias YES
Low-Offset YES
Micropower YES
Neg Supply Voltage Limit-Max -9 V
Neg Supply Voltage-Nom (Vsup) -5 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified
Slew Rate-Nom 2.5 V/us 2.5 V/us
Supply Current-Max 0.8 mA
Supply Voltage Limit-Max 9 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1500 4700
Voltage Gain-Min 316000
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code SOIC
Pin Count 8
Length 4.9 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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