TC9089AF
vs
SAA4961
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
0.600 INCH, PLASTIC, MO-015AH, SOT117-1, DIP-48
|
| Pin Count |
28
|
48
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
Y/C SEPARATOR IC
|
Y/C SEPARATOR IC
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDIP-T28
|
| Length |
18.5 mm
|
35.5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.7 mm
|
5.1 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
8.8 mm
|
15.24 mm
|
| Base Number Matches |
1
|
2
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
DIP28,.6
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare TC9089AF with alternatives
Compare SAA4961 with alternatives