TC850CLW
vs
TC850CLW713
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
LCC
|
LCC
|
Package Description |
QCCJ, DIP40,.6
|
QCCJ, LDCC44,.7SQ
|
Pin Count |
44
|
44
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
13 Weeks
|
13 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Analog Input Voltage-Max |
3.5 V
|
3.5 V
|
Analog Input Voltage-Min |
3.2 V
|
3.2 V
|
Converter Type |
ADC, MULTI-SLOPE
|
ADC, MULTI-SLOPE
|
JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
JESD-609 Code |
e3
|
e3
|
Length |
16.585 mm
|
16.585 mm
|
Linearity Error-Max (EL) |
0.0061%
|
0.0061%
|
Moisture Sensitivity Level |
1
|
1
|
Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
15
|
15
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC44,.7SQ
|
LDCC44,.7SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
245
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
16.585 mm
|
16.585 mm
|
Base Number Matches |
3
|
1
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|