TC7W139FU vs SN74LVC1G139YZPR feature comparison

TC7W139FU Toshiba America Electronic Components

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SN74LVC1G139YZPR Texas Instruments

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC BGA
Package Description LSSOP, TSSOP8,.16 GREEN, DSBGA-8
Pin Count 8 8
Reach Compliance Code unknown compliant
Samacsys Manufacturer Toshiba Texas Instruments
Family HC/UH LVC/LCX/Z
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G8 R-XBGA-B8
JESD-609 Code e0 e1
Length 2.9 mm 1.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.004 A 0.032 A
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LSSOP VFBGA
Package Equivalence Code TSSOP8,.16 BGA8,2X4,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Prop. Delay@Nom-Sup 33 ns 5.9 ns
Propagation Delay (tpd) 165 ns 16.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.3 mm 0.5 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 4.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 2.8 mm 0.9 mm
Base Number Matches 4 1
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature TXIIK01157
Moisture Sensitivity Level 1
Number of Bits 1
Output Characteristics 3-STATE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA
Time@Peak Reflow Temperature-Max (s) 30

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