TC7SZ17AFS vs NLV18SZ17DFT2G feature comparison

TC7SZ17AFS Toshiba America Electronic Components

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NLV18SZ17DFT2G onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TOSHIBA CORP ON SEMICONDUCTOR
Part Package Code SON
Package Description VSOF, TSSOP, TSSOP5/6,.08
Pin Count 5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-F5 R-PDSO-G5
Length 1 mm 2 mm
Logic IC Type BUFFER BUFFER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSOF TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 17 ns 15.6 ns
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 2.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form FLAT GULL WING
Terminal Pitch 0.35 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 0.8 mm 1.25 mm
Base Number Matches 1 1
Factory Lead Time 4 Weeks
Date Of Intro 2020-01-16
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.032 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 7.5 ns
Schmitt Trigger YES
Screening Level AEC-Q100
Terminal Finish MATTE TIN

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