TC7SZ17AFS
vs
NLV18SZ17DFT2G
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TOSHIBA CORP
|
ON SEMICONDUCTOR
|
Part Package Code |
SON
|
|
Package Description |
VSOF,
|
TSSOP, TSSOP5/6,.08
|
Pin Count |
5
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Toshiba
|
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-F5
|
R-PDSO-G5
|
Length |
1 mm
|
2 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSOF
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Propagation Delay (tpd) |
17 ns
|
15.6 ns
|
Seated Height-Max |
0.5 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
2.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
0.35 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
0.8 mm
|
1.25 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
Date Of Intro |
|
2020-01-16
|
JESD-609 Code |
|
e3
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.032 A
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
TSSOP5/6,.08
|
Packing Method |
|
TR
|
Power Supply Current-Max (ICC) |
|
0.01 mA
|
Prop. Delay@Nom-Sup |
|
7.5 ns
|
Schmitt Trigger |
|
YES
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare TC7SZ17AFS with alternatives
Compare NLV18SZ17DFT2G with alternatives