TC7SZ08FU
vs
74LVC1G08GW,115
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
SSOP
TSSOP
Package Description
TSSOP, TSSOP5/6,.08
TSSOP,
Pin Count
5
5
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Samacsys Manufacturer
Toshiba
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
Length
2 mm
2.05 mm
Load Capacitance (CL)
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.032 A
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.02 mA
Prop. Delay@Nom-Sup
5.5 ns
Propagation Delay (tpd)
10.5 ns
10.5 ns
Schmitt Trigger
NO
Screening Level
AEC-Q100
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
1.25 mm
1.25 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT353
JESD-609 Code
e3
Temperature Grade
AUTOMOTIVE
Terminal Finish
TIN
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