TC7SZ08FU vs 74LVC1G08GW,115 feature comparison

TC7SZ08FU Toshiba America Electronic Components

Buy Now Datasheet

74LVC1G08GW,115 NXP Semiconductors

Buy Now Datasheet
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SSOP TSSOP
Package Description TSSOP, TSSOP5/6,.08 TSSOP,
Pin Count 5 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Samacsys Manufacturer Toshiba
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2 mm 2.05 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.032 A
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.02 mA
Prop. Delay@Nom-Sup 5.5 ns
Propagation Delay (tpd) 10.5 ns 10.5 ns
Schmitt Trigger NO
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 1 2
Manufacturer Package Code SOT353
JESD-609 Code e3
Temperature Grade AUTOMOTIVE
Terminal Finish TIN

Compare TC7SZ08FU with alternatives

Compare 74LVC1G08GW,115 with alternatives