Findchips: Compare TC7SZ08FU(T5L,JF,T vs 74LVC1G08GW-Q100,1

TC7SZ08FU(T5L,JF,T vs 74LVC1G08GW-Q100,1 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	TOSHIBA CORP	NXP SEMICONDUCTORS
Part Package Code	SSOP	TSSOP
Package Description	TSSOP,	1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1,TSSOP-5
Pin Count	5	5
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
Length	2 mm	2.05 mm
Logic IC Type	AND GATE	AND GATE
Number of Functions	1	1
Number of Inputs	2	2
Number of Terminals	5	5
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED	260
Propagation Delay (tpd)	10.5 ns	10.5 ns
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.8 V	1.65 V
Supply Voltage-Nom (Vsup)	5 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	30
Width	1.25 mm	1.25 mm
Base Number Matches	1	1
Manufacturer Package Code		SOT353-1
JESD-609 Code		e3
Moisture Sensitivity Level		1
Packing Method		TR, 7 INCH
Screening Level		AEC-Q100
Terminal Finish		TIN
	Logic » Gates	Logic » Gates