TC7SZ08FE vs 74LVC1G08GW feature comparison

TC7SZ08FE Toshiba America Electronic Components

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74LVC1G08GW NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SON TSSOT
Package Description VSOF, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Pin Count 5 5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-F5 R-PDSO-G5
Length 1.6 mm 2.05 mm
Logic IC Type AND GATE AND GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSOF TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 9.8 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.6 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form FLAT GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.2 mm 1.25 mm
Base Number Matches 6 12
Pbfree Code Yes
ECCN Code EAR99
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Prop. Delay@Nom-Sup 6 ns
Schmitt Trigger NO
Terminal Finish Tin (Sn)

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Compare 74LVC1G08GW with alternatives